PVD and DLC are Performed in a Vacuum Chamber-Physical vapor deposition (PVD) describes a variety of vacuum deposition methods which can be used to produce thin films and coatings. PVD is characterized by a process in which the material goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering & ARC evaporation. PVD is highly used in the manufacturing industry for many products which require thin films for mechanical, medical, optical, chemical or electronic functions.
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